NXPI - Sector: Technology---Industry: Semiconductors

[setravis]

Tuesday, February 15, 2011...
Earnings Reports
NXPI-NXP Semiconductor NV (0.47)

We failed to pay close attention to this one after it was listed in this post...
http://www.3stocksonfire.org/trading/index.php?topic=10121.msg123414#msg123414

Day's Range: 28.46 - 31.68
52wk Range: 10.23 - 33.87
Volume: 3,422,634
Avg Vol (3m): 1,065,290
Market Cap: 7.85B

Technicals
Percentage Gainer
Price Gainer

Last Price Quote is:
12.71%above 13-day EMA
19.05%above 50-day EMA
RS Rating: 95  

Nice bounce off the 13-day MA...

[setravis]

Profile: 

NXP Semiconductors NV
High Tech Campus 60
Eindhoven, 5656 AG
Netherlands - Map
Phone: 31 40 272 9233
Fax: 31 40 272 2415
Website: http://www.nxp.com

Details   
Index Membership: N/A
Sector: Technology
Industry: Semiconductor - Broad Line
Full Time Employees: 27,272


Business Summary   

NXP Semiconductors N.V., through its subsidiary NXP B.V., provides mixed signal solutions and semiconductor components. It offers small signal, power, and integrated discretes; mobile device speakers and receivers; amplifiers; bipolar transistors; data converters; microcontrollers; sensors; and thyristors. The company's products find applications in wireless, lighting, home appliances, industrial, mobile telecommunication, automotive, security, television, and electronics sectors. NXP Semiconductors N.V. was formerly known as KASLION Acquisition B.V. The company was founded in 2006 and is based in Eindhoven, the Netherlands. NXP Semiconductors N.V. operates as a subsidiary of KASLION Holding B.V.

Business Overview

BRIEF: For the fiscal year ended 31 December 2010, NXP Semiconductors NV Inc.'s revenues increased 25% to $4.4B. Net loss from continuing operations totaled $515M, up from $199M. Revenues reflect an increase in sales of High Performance products and higher Standard products sales. higher loss reflects an increase selling expenses, higher general & administrative expenses and the presence of other income vs. an expense. http://www.nxp.com/

[setravis]

NXP Releases World's Smallest Logic Packages for Handheld Mobility
6- and 8-Pin Plastic Leadless Packages Up to 60 Percent Smaller With Improved Mechanical Performance and Robustness

NXP releases the world's smallest logic plastic packages measuring 0.9 x 1.0 x 0.35 mm with 0.3 mm pitch. The world's smallest logic plastic packages shown here smaller than a ladybug.

EINDHOVEN, NETHERLANDS--(Marketwire - 03/29/11) - NXP Semiconductors N.V. (NASDAQ:NXPI - News) today announced the world's smallest logic plastic packages measuring 0.9 x 1.0 x 0.35 mm with 0.3 mm pitch. The ultra-compact packaging design is ideal for leading-edge portable handheld devices such as smartphones, tablets and SD cards where chip and board space comes at a premium. The SOT1115 package decreases package size by 10 percent for the 6-pin version compared to the previous smallest package, SOT891, of which NXP has produced over one billion units. The 8-pin SOT1116 decreases the package size by 60 percent, compared to the previous smallest 8-pin package SOT833, enabling manufacturers to radically minimize their PCB size.

"Smartphones and eReaders are getting smaller and thinner. As manufacturers strive to pack more features and functionality into these confined spaces, logic chips provide design flexibility in tiny packages. Logic is the glue that connects everything together," said Pierre-Yves Lesaicherre, senior vice president and general manager, microcontrollers and logic, NXP Semiconductors. "As the largest leadless plastic package manufacturer in the world, we work very closely with the leading innovative customers in the market. Our latest logic leadless packages dramatically shrink package size making it possible to design slimmer phones, tablets and other portable devices without taking up valuable real estate --- offering real return on investment."

NXP has conducted studies of the mechanical failure modes of very small logic packages and determined that leadless plastic packages perform better in terms of mechanical adherence to the PCB. When compared against packages of the same footprint, NXP's leadless packages outperform leaded and leadless WCSP packages of similar size by requiring up to four times more force to dislodge. This is because NXP's leadless packages have a greater contact area with the PCB, giving them better mechanical performance and robustness.

NXP Packaging: SOT1115 and SOT1116
NXP is a leader in small leadless plastic packages and has shipped over two billion of these small leadless plastic packages. Leveraging NXP's unique expertise and dedicated R&D operation, the SOT1115 and SOT1116 are designed for portable devices, where board space, cost and reliability are a primary concern. Key features of the SOT1115 and SOT1116 include the smallest footprint, greatest electrical contact area, and shear force resistance from the PCB. All of NXP's single-, dual- and triple-gate functions are available in these new, smaller packages.

Availability
NXP SOT1115 and SOT1116 packages are available from distribution at US $0.16 and $0.21 respectively. Further information on the new products can be found at: http://ics.nxp.com/packaging/micropak/

About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ:NXPI - News) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 30 countries, NXP posted revenue of $4.4 billion in 2010. For more information visit www.nxp.com.

Forward-looking Statements

This document includes forward-looking statements which include statements regarding our business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward- looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions, our ability to successfully introduce new technologies and products, the demand for the goods into which our products are incorporated, our ability to generate sufficient cash, raise sufficient capital or refinance our debt at or before maturity to meet both our debt service and research and development and capital investment requirements, our ability to accurately estimate demand and match our production capacity accordingly or obtain supplies from third-party producers, our access to production from third-party outsourcing partners, and any events that might affect their business or our relationship with them, our ability to secure adequate and timely supply of equipment and materials from suppliers, our ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly, our ability to form strategic partnerships and joint ventures and successfully cooperate with our alliance partners, our ability to win competitive bid selection processes to develop products for use in our customers' equipment and products, our ability to successfully establish a brand identity, our ability to successfully hire and retain key management and senior product architects; and, our ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and our business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, our market segments and product areas will develop. We have based these assumptions on information currently available to us, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While we do not know what impact any such differences may have on our business, if there are such differences, our future results of operations and our financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, we do not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website, www.nxp.com/investor or from the SEC website, www.sec.gov.

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Image Available: http://www2.marketwire.com/mw/frame_mw?attachid=1558053


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[setravis]

NXP and Dover Provide an Update on the Timing of the Closing of the Sound Solutions Transaction

Press Release Source: NXP Semiconductors On Monday March 28, 2011, 2:00 am EDT
EINDHOVEN, THE NETHERLANDS--(Marketwire - 03/28/11) - NXP Semiconductors N.V. (NASDAQ:NXPI - News) and Dover Corporation (NYSE:DOV) provide an update on the timing of the closing of the Sound Solutions transaction. A non-U.S. and non-EU governmental antitrust regulator has requested additional briefings in connection with its review of the sale of NXP's Sound Solutions business to Knowles Electronics, an affiliate of Dover Corporation. As a result, NXP and Dover Corporation currently expect the transaction to close around the middle of the second quarter of 2011, subject to regulatory approval. Apart from the antitrust procedure referred to above, all other closing conditions and actions have been completed in all material respects and are ready to be implemented. As before, there is no assurance that antitrust clearance will be obtained. NXP and Dover Corporation previously anticipated, subject to regulatory approvals and customary closing conditions, the transaction would likely close on or about the end of the first quarter of 2011.

Forward-looking Statements
This document includes forward-looking statements which include statements regarding our business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions, our ability to successfully introduce new technologies and products, the demand for the goods into which our products are incorporated, our ability to generate sufficient cash, raise sufficient capital or refinance our debt at or before maturity to meet both our debt service and research and development and capital investment requirements, our ability to accurately estimate demand and match our production capacity accordingly or obtain supplies from third-party producers, our access to production from third-party outsourcing partners, and any events that might affect their business or our relationship with them, our ability to secure adequate and timely supply of equipment and materials from suppliers, our ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly, our ability to form strategic partnerships and joint ventures and successfully cooperate with our alliance partners, our ability to win competitive bid selection processes to develop products for use in our customers' equipment and products, our ability to successfully establish a brand identity, our ability to successfully hire and retain key management and senior product architects; and, our ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and our business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, our market segments and product areas will develop. We have based these assumptions on information currently available to us, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While we do not know what impact any such differences may have on our business, if there are such differences, our future results of operations and our financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, we do not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website, http://www.nxp.com/investor or from the SEC website, http://www.sec.gov.

About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ:NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 30 countries, NXP posted revenue of $4.4 billion in 2010. For more information visit www.nxp.com.

Contact: